LED Lighting Adhesive Heat Transfer Cooling Tape With Glass Fabric
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High Quality Thermal Pad Gap Filling Pad Insulation Materials
MOQ ：2000 piece
Lead Time ：5 Days
Seller Support : Trade Authenticity Guaranteed & Accepting
Payment : T/T,Credit Card,Pay Pal,Other
Departure Port : Shenzhen
Product details
Supply Ability
- Supply Ability：5000000 pieces
Product Specifications
- Brand name：LTD
Product Description
High Quality Thermal Pad Gap Filling Pad Insulation Materials
LC thermal silicone pad is a very cost-effective general economic thermal gap filling gasket. Made of Japan Electric Denka spherical alumina powder and Dow Corning polymer, under low compressing force, it shows good thermal conductivity and electrical insulation properties. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full contact forming a continuous thermal conduction and achieve a good cooling purposes. | ||||||||
Physical Properties | ||||||||
Test Item | Test Method | Unit | LC120 | LC200 | LC300 | LC400 | LC500 | LC600 |
Color | Visual | --- | Grey/ White | Blue | Grey/ Blue | Light blue | Grey | Grey |
Thickness | ASTM D374 | Mm | 0.3~15.0 | 0.3~10.0 | 0.3~10.0 | 0.3~5.0 | 0.5~5.0 | 0.5~5.0 |
Density | ASTM D792 | g/cm3 | 2.1 | 2.5 | 3 | 3.24 | 3.32 | 3.43 |
Hardness | ASTM D2240 | (Shore OO） | 40~80 | 40~80 | 40~80 | 60~80 | 60~80 | 60~80 |
Tensile Strength | ASTM D412 | Mpa | 0.31 | 0.28 | 0.14 | 0.25 | 0.16 | 0.14 |
Elongation | ASTM D412 | % | 100 | 55 | 43 | 35 | 43 | 18 |
Weight Loss | @150℃240H | % | ≤0.5% | ≤0.3% | ≤0.3% | ≤0.5% | ≤0.5% | ≤0.5% |
Continuous Use Temp | EN344 | ℃ | -40~+150 | -40~+220 | -40~+220 | -40~200 | -40~+220 | -40~+220 |
Volume Resistivity | ASTM D257 | Ω*cm | 8×1012 | 5×1012 | 1×1012 | 1×1013 | 2×1013 | 2×1013 |
Voltage Endurance | ASTM D149 | KV/mm | ≥10 | ≥10 | ≥10 | ≥5 | ≥7 | ≥7 |
Flame Rating | UL-94 | --- | V0 | V0 | V0 | V0 | V0 | V0 |
Dielectric Constant | ASTM D150 | @1MHz | 5.41 | 5.69 | 7 | 6.75 | 7.92 | 7.47 |
Thermal Conductivity | ASTM D5470 | W/m*k | 1.2 | 2.0 | 3.0 | 4.0 | 5.0 | 6.0 |
Features & Benefits | Cost-effective, high conductivity, low thermal resistance Soft and flexible, reducing the interface thermal resistance High electrical insulation to protect electronic devices Natural sticky, easy application, reworkable Meet ROHS and UL environmental requirements | |||||||
Typical Applications | High thermal conductivity module New energy vehicles Microprocessors, memory chips and graphics processors Network communication equipment Car equipment, charger High-speed hard disk drive | |||||||
Related Products:
LC thermal pad LE thermal grease LT Al2O3 ceramic LT1800 ALN sheet LCT thermal tape PCM
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Business Type : Manufacturer
Company Location: GUANG DONG
Year Established: 14YRS
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High Quality Thermal Pad Gap Filling Pad Insulation Materials
